We're pleased to offer our customers a complete outsourced solution for the preparation and packaging of electronic components. Many customers find it more cost effective and efficient to have us provide these services than it is for them to staff and maintain their own prep departments.

Our electronic component prep services include:

• Component forming
• BGA rework
• Lead straightening
• Programming
• Baking
• PCB repair (to applicable IPC standards)
• Testing
• Automation projects
• Component taping (radial, axial and SMD)
• Customized packaging requirements
• Packaging materials (LXI stocks a large inventory of carrier, cover tape, anti-static bags, and reels. All of this meets all EIA standards.)

Qualification, testing and validation services are offered to all users of electronic components. Processes insure that tested devices conform to prescribed design specs and are suitable for their intended use and application.

Qualification, Testing and Validation Services include:

• Screening & qualification standards
• Electrical testing, qualification & validation
• Mechanical testing, qualification & validation
• Environmental testing
• Memory erasing & programming
• Lead forming, trimming & straightening

Rack and small barrel plating for various industries such as electronics, aerospace, telecommunications and electromechanical. Plating certified to ASTM, Mil-Specs or in-house specifications.

Rack and Small Barrel Plating Finishes include:

• Electroless Nickel (MIL-C-26074)
• Gold (MIL-C-45204-GRD C)
• Matte Silver (QQ-S-365-TY I)
• Bright Silver (QQ-S-365-TY II & III)
• Sulfamate & Bright Nickel (QQ-N-290)
• Copper (MIL-C-14550)
• Tin - Dull & Bright (MIL-T-10727 TY I)
• Tin Lead (MIL-P-81728)
• Decorative Chrome (QQ-C-320 TY I or II CL I)
• Black Chrome (MIL-C-14538)
• Zinc - clear, yellow or black chromate (ASTM-B-633)
• Black Oxide on Copper (MIL-F-495)